![]() ![]() Using aluminum instead of gold may reduce project costs. Wedge Bonding Services in Beckermus Technologies are available in gold wire and aluminum wire. CAE has 3964 bonders currently available for sale from a number of respected OEMs, including ASM, K&S, SHINKAWA and many others. The most prominent advantage of ball bonding stems from the ability to produce super complex wire loops with multiple tiers levels and crossing wires. 13 Gold Ball Wire Bonding System Extreme High Speed Wire Bonder ASM GoCu A capability enabling faster and easy conversion from Gold to Cu/CuPd wire bonding. CAE finds the best deals on used bonders. ![]() The bonding can be performed in Fine Pitch between pads of up to 35 microns, or a simple standard bond. Our supported wire Bonding techniques include Ball Bonding and Wedge Bonding supporting a variety of wire diameters in range of 0.7mil up to 2mil, based on project's specifications.īall Bonding Services in Beckermus Technologies are available in gold wire and copper wire. In Beckermus Technologies, we supply the complete set of bonding services required for IC Assembly and use the most up-to-date machinery and bonding materials.Ī partial list of our automated machines includes K&S ICONN Plus, ASM, and Delvotec. CRITICAL PRECAUTIONS AND COMMON MISTAKES Keep hands out of the working a rea while the Bonding Tool is in operation Be aware of high temperature of the work holder and use tweezers when placing the. The term wire bond or wire bonding is a Micro Assembly service used to describe the process of connecting between a bare die chip (IC) to a substrate, package or other die. Standard Wedge Tool and Wire Specifications for Au Wire Configuration.
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